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>> IHS Markit: Flexible AMOLED Panel Cost Analysis 5th,Sep,2017
Recently, the flexible AMOLED panel has received more and more attention. Since Samsung launched the Galaxy S edge series of smart phones, flexible AMOLED panel shipments grew rapidly. At this stage, most flexible AMOLED display products are not repeatable. The substrate uses a thick layer of polyimide (PI) instead of glass, but uses a glass substrate as a carrier for the PI layer during the manufacturing process. Top Use a thin film package (TFE) to protect the OLED layer rather than the glass package.
IHS provides flexible AMOLED panel cost analysis in the recent OLED Cost Model report.
As shown in the figure above, the 5.5 "QHD flexible AMOLED panel costs about $ 24, 25% higher than a rigid panel with the same resolution.
However, it should be noted that the flexible AMOLED panel is mainly produced in the six-generation line factory, and most of the commercially available rigid AMOLED plants are 5.5-generation lines, so the 25% cost gap is in the six-generation line of flexible panels and 5.5 on behalf of the rigid panel produced on the basis of. If the rigid AMOLED panel is also produced in the six-generation line factory, then the cost will be reduced by about 20%. In other words, if the flexible AMOLED and rigid AMOLED panels are produced in the six-generation line factory, then the cost of production gap between the two will be much greater than 25%.
The above is a different cost structure for both
The main difference between the flexible and rigid AMOLED panels is the substrate. The flexible panel uses the PI layer as the substrate, while the rigid panel still uses the glass substrate. But as shown above, this does not have a significant impact on the cost of array material. Since the Galaxy S Edge series of mass production since the PI material prices have dropped a lot. Similar trends have been found in the cost of packaging materials. The cost share of the encapsulated material in the flexible panel is much lower than that of the rigid panel. With the introduction of TFE and the gradual elimination of packaging glass, IHS Markit estimates that the total cost of flexible AMOLED panels will not increase.
At the same time, the flexible AMOLED panel has a significant increase in the cost of the module material. Flexible AMOLED uses COF (Chip On Film) driver chip architecture, which adds additional PCB costs. In addition, the lamination on the curved surface is still very difficult, which may lead to a decrease in yield in the module process.
The above cost estimates do not include touch and cover costs. Flexible displays have higher touch and cover costs, which in turn increases the total cost gap between rigid and flexible panels.
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